Price:
$15.78

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Description

1. Used to locate and relocate mobile phone PCB BGA parts
2. Conveniently and quickly re-bombard the BGA without causing any damage, providing a solution for the repositioning and repair of iPhone 11/11 Pro / 11 Pro Max BGA
3. Unique hole design makes it easier to take out the formed solder balls
4. Fast and convenient soldering
5. Size: about 13x9x1.7cm

Specification:
Package Weight
One Package Weight 0.32kgs / 0.70lb
Qty per Carton 80
Carton Weight 25.80kgs / 56.88lb
Carton Size 43cm * 32cm * 31cm / 16.93inch * 12.6inch * 12.2inch

OEM are Welcome! we can print customised artwork and logo

More Pictures

IPXG0348
IPXG0348
IPXG0348

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